Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics-Reference-Cited by-同舟云学术

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Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Published:2022-04-28 Issue:9 Volume:7 Page:2200302
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv Materials Technologies

Author:

Sun Peng¹,Zhang Jinbao¹,Zhu Xiaoyang¹^ORCID,Li Hongke¹,Li Yang¹,Yang Jianjun¹,Peng Zilong¹,Zhang Guangming¹,Wang Fei¹,Lan Hongbo¹

Affiliation:

1. Shandong Engineering Research Center for Additive Manufacturing Qingdao University of Technology Qingdao 266520 China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202200302

Reference51 articles.

1. Advanced Soft Materials, Sensor Integrations, and Applications of Wearable Flexible Hybrid Electronics in Healthcare, Energy, and Environment

2. 3D Printing of Self‐Wiring Conductive Ink with High Stretchability and Stackability for Customized Wearable Devices

3. Flexible transparent electromagnetic interference shielding films with silver mesh fabricated using electric-field-driven microscale 3D printing

4. Hybrid 3D Printing of Soft Electronics

5. All‐Printed Flexible and Stretchable Electronics with Pressing or Freezing Activatable Liquid‐Metal–Silicone Inks

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Materials, Structure, and Interface of Stretchable Interconnects for Wearable Bioelectronics;Advanced Materials;2024-08-13

2. A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing;Coatings;2024-05-15

3. Fabrication Techniques for Multilayer Printed Flexible Hybrid Sensor Systems;IEEE Journal on Flexible Electronics;2024-05

4. Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics;Japanese Journal of Applied Physics;2024-04-01

5. 3D printed heterogeneous bilayer temperature-responsive hydrogel with multi-curvature deformation;Polymer;2024-03

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