Affiliation:
1. School of Electrical and Computing Engineering Indian Institute of Technology Mandi Mandi Himachal Pradesh 175005 India
2. School of Mechanical and Materials Engineering Indian Institute of Technology Mandi Mandi Himachal Pradesh 175005 India
3. Department of Electrical Engineering Indian Institute of Technology Jodhpur Jodhpur Rajasthan 342030 India
Abstract
AbstractThis research unveils a transformative methodology for fabricating flexible printed circuit boards (PCBs), focusing on the unique attributes of filter paper substrates. A meticulous parametric exploration scrutinizes critical aspects such as buckling resistance, charging current, plating time, and electrode configurations for copper electroplating. Key findings highlight the exceptional stability of copper electroplating on filter paper, exhibiting robust resistance against environmental variations and bending angles spanning +180° to −180°. Utilizing higher pencil grade material and maintaining a minimum 4 cm distance with a voltage range of 3 to 1.44 V ensures uniform, controlled plating without burning, optimizing the electrode area below 1 cm2 for enhanced practicality. The research underscores the longevity and durability of copper‐plated filter paper, with negligible resistance changes even after 1000 folds. Over a year, the shelf‐life assessment emphasizes the excellent stability of electroplated filter paper. Practical applications, including fully functional circuits and a bio‐degradable piano, underscore the versatility and real‐world feasibility of the proposed electroplating technique.