A Stretchable Thermoelectric Device based on Direct Ink Writing of Liquid Metal and Multi‐Layer Lamination

Author:

Kim Hayeon1ORCID,Bae Joonbum1ORCID

Affiliation:

1. Department of Mechanical Engineering UNIST Ulsan 44919 Korea the Republic of

Abstract

AbstractWearable thermoelectric devices are widely used due to their ability to generate heat and cool rapidly without the need for bulky external equipment. Researchers have explored methods to enhance flexibility and stretchability by incorporating liquid metal as an electrode. However, the challenge lies in the low thermal conductivity of the polymer, which hampers heating and cooling performance. Traditional methods, like molding and spraying, increase the thickness of both liquid metal and polymer channels, but this added thickness does not significantly improve the device's stretchability.[1, 2] To overcome these issues, this paper proposes a stretchable thermoelectric device (STED), which offers improved heating and cooling capabilities, as well as enhanced stretchability. To enhance the thermal conductivity of the polymer, Ag powder with varying particle sizes is mixed with the material. Additionally, the liquid metal is deposited using the direct ink writing (DIW) method, reducing the whole thickness of STED. The air layer is created by printing molten isomalt, which is subsequently removed using water. The proposed STED exhibits high stretchability, reaching up to 150 %, enabling flexible twisting in various directions. The double‐layer structure resulted in a maximum temperature decrease of 14 °C at room temperature.

Funder

National Research Foundation of Korea

Korea Creative Content Agency

Ministry of Culture, Sports and Tourism

Publisher

Wiley

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3