An Intelligent Glove System for Real‐Time Multiple Electrical Signal Acquisition and Display

Author:

Qiu Yulin1,Dai Xingyi1,Yang Jingkun1,Liao Jiaying1,Han Jiaxin1,Wu Yinghui1,Cao Yajun1,Zhang Xuyang1,Zhong Aihua1,Ni He2,Huang Long‐Biao13ORCID

Affiliation:

1. Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Physics and Optoelectronic Engineering Shenzhen University Shenzhen 518060 P. R. China

2. Power Engineering College Naval University of Engineering No. 717 Jiefang Avenue Wuhan Hubei Province 430033 P. R. China

3. National Key Laboratory of Green and Long‐Life Road Engineering in Extreme Environment Shenzhen University Shenzhen 518060 P. R. China

Abstract

AbstractRealizing multimodal tactile perception for robots is highly desirable for achieving more intelligent human–machine interaction. A real‐time intelligent glove system that can capture and monitor hand tactile information, including pressure, bending, and temperature is proposed. This system processes the collected data and visualizes the tactile information in a 2D image. The intelligent glove system integrates a palm‐shaped sensor unit, a multi‐channel data acquisition board, and a data analysis module. The glove consists of 34 flexible sensors, including 28 pressure sensors, five bending sensors, and one temperature sensor, which convert biological information into electrical signals. By enhancing the performance of the system, the intelligent glove achieves high sensitivity and good fault tolerance, allowing it to analyze the multimodal tactile information of the entire hand with fast responsivity. By analyzing the acquired multi‐channel electrical signals, the system can analyze object shapes and various gripping states. This work paves the way for wearable devices used in multimodal tactile perception and promotes the emergence of new modes of human–machine interaction.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

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