Multimodal Neural Probes with Small Form Factor Based on Dual‐Side Fabrication-Reference-Cited by-同舟云学术

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Multimodal Neural Probes with Small Form Factor Based on Dual‐Side Fabrication

Published:2022-10-30 Issue:2 Volume:8 Page:
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv Materials Technologies

Author:

Kim Mi Kyung¹,Leong Jia Chee¹,Jo Yehhyun¹,Kook Geon¹,Lee Hyunjoo J.¹²^ORCID

Affiliation:

1. School of Electrical Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon 34141 Republic of Korea

2. KAIST Institute for Health Science and Technology (KIHST) Daejeon 34141 Republic of Korea

Funder

Ministry of Trade, Industry and Energy

National Research Foundation of Korea

Ministry of Science and ICT, South Korea

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202200692

Reference55 articles.

1. Neural Probes for Chronic Applications

2. Flexible, Penetrating Brain Probes Enabled by Advances in Polymer Microfabrication

3. Novel electrode technologies for neural recordings

4. Multifunctional multi-shank neural probe for investigating and modulating long-range neural circuits in vivo

5. Challenges and opportunities for large-scale electrophysiology with Neuropixels probes

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1. Flexible high-density microelectrode arrays for closed-loop brain–machine interfaces: a review;Frontiers in Neuroscience;2024-04-15

2. Flexible Dual-Sided Polymer Microelectrode Array for Neurophysiological Recordings from an Insect Brain;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21

3. Cellular Calcium Activity at Depth Predicted from Surface Potential Recordings using Ultra-high Density Transparent Graphene Arrays;2023-10-08

4. Miniature Transparent Dopamine Sensor Based on Nanosphere Lithography;Advanced Materials Technologies;2023-04-02

5. A flexible neural probe with electrodeposited silk composite as an insertion shuttle;2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2023-03-07

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