Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering-Reference-Cited by-同舟云学术

Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Published:2022-04-03 Issue:8 Volume:7 Page:2200097
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv Materials Technologies

Author:

Kornbluth Yosef S.¹^ORCID,Parameswaran Lalitha²^ORCID,Mathews Richard²^ORCID,Racz Livia M.²^ORCID,Velásquez‐García Luis F.³^ORCID

Affiliation:

1. Department of Mechanical Engineering Massachusetts Institute of Technology 77 Massachusetts Ave. Cambridge MA 02139 USA

2. MIT Lincoln Laboratory 244 Wood St Lexington MA 02421 USA

3. Microsystems Technology Laboratories Massachusetts Institute of Technology 77 Massachusetts Ave., Office 39–415B Cambridge MA 02139 USA

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202200097

Reference63 articles.

1. Additive Manufacturing Technologies

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