Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems
Author:
Affiliation:
1. Bendable Electronics and Sensing Technologies (BEST) group; Electronics and Nanoscale Engineering; University of Glasgow; Glasgow G12 8QQ UK
2. Microsystems Technology Research Unit; Fondazione Bruno Kessler; Trento 38123 Italy
Funder
European Commission
Engineering and Physical Sciences Research Council
Publisher
Wiley
Subject
Electronic, Optical and Magnetic Materials
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/aelm.201700277/fullpdf
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1. Stretchable, Large-area Organic Electronics
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