Conformal Cu Coating on Electrospun Nanofibers for 3D Electro‐Conductive Networks-Reference-Cited by-同舟云学术

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Conformal Cu Coating on Electrospun Nanofibers for 3D Electro‐Conductive Networks

Published:2019-12-23 Issue:2 Volume:6 Page:1900767
ISSN:2199-160X
Container-title:Advanced Electronic Materials
language:en
Short-container-title:Adv. Electron. Mater.

Author:

Jiang Fuze¹²,Ju Wenbo²,Pan Zhengyuan¹²³,Lin Luchan²,Yue Yang¹²,Zhao Yi‐Bo¹²,Li Congju⁴,Clemens Frank²,Battaglia Corsin²,Wang Jing¹²^ORCID

Affiliation:

1. Institute of Environmental EngineeringETH Zürich Stefano‐Franscini‐Platz 3 8093 Zürich Switzerland

2. EmpaSwiss Federal Laboratories for Materials Science and Technology Überland Strasse 129 8600 Dübendorf Switzerland

3. School of Light Industry and EngineeringSouth China University of Technology Guangzhou 510640 China

4. School of Energy and Environmental EngineeringUniversity of Science and Technology Beijing Beijing 100083 China

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aelm.201900767

Reference56 articles.

1. Electrospun nanomaterials for ultrasensitive sensors

2. Inflammation-free, gas-permeable, lightweight, stretchable on-skin electronics with nanomeshes

3. Flexible transparent conductors based on metal nanowire networks

4. Chemical formation of soft metal electrodes for flexible and wearable electronics

5. An overview of electrospun nanofibers and their application in energy storage, sensors and wearable/flexible electronics

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