Mimicking Neuroplasticity via Ion Migration in van der Waals Layered Copper Indium Thiophosphate-Reference-Cited by-同舟云学术

Mimicking Neuroplasticity via Ion Migration in van der Waals Layered Copper Indium Thiophosphate

Published:2021-10-15 Issue: Volume: Page:2104676
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Advanced Materials

Author:

Chen Jiangang¹²,Zhu Chao³,Cao Guiming¹,Liu Haishi¹,Bian Renji¹,Wang Jinyong¹,Li Changcun¹,Chen Jieqiong³,Fu Qundong³,Liu Qing¹,Meng Peng¹,Li Wei¹,Liu Fucai¹²,Liu Zheng³⁴⁵^ORCID

Affiliation:

1. School of Optoelectronic Science and Engineering University of Electronic Science and Technology of China Chengdu 610054 China

2. Yangtze Delta Region Institute (Huzhou) University of Electronic Science and Technology of China Huzhou 313099 China

3. School of Materials Science and Engineering Nanyang Technological University BLK N4.1, 50 Nanyang Avenue Singapore 639798 Singapore

4. School of Electrical and Electronic Engineering Nanyang Technological University Singapore 639798 Singapore

5. CINTRA CNRS/NTU/THALES Research Techno Plaza, UMI 3288 Singapore 637553 Singapore

Funder

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Applied Basic Research Program of Sichuan Province

Ministry of Education - Singapore

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202104676

Reference50 articles.

1. A comprehensive review on emerging artificial neuromorphic devices

2. Bridging Biological and Artificial Neural Networks with Emerging Neuromorphic Devices: Fundamentals, Progress, and Challenges

3. Color‐Recognizing Si‐Based Photonic Synapse for Artificial Visual System

4. Memristive crossbar arrays for brain-inspired computing

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