Affiliation:
1. Key Laboratory of Organic Integrated Circuits Ministry of Education Tianjin Key Laboratory of Molecular Optoelectronic Sciences Department of Chemistry Institute of Molecular Aggregation Science Tianjin University Tianjin 300072 China
2. Joint School of National University of Singapore and Tianjin University International Campus of Tianjin University Fuzhou 350207 China
3. Haihe Laboratory of Sustainable Chemical Transformations Tianjin 300192 China
Abstract
AbstractIntegrating the merits of low cost, flexibility, and large‐area processing, organic semiconductors (OSCs) are promising candidates for the next‐generation electronic materials. The mobility and stability are the key figures of merit for its practical application. However, it is greatly challenging to improve the mobility and stability simultaneously owing to the weak interactions and poor electronic coupling between OSCs molecules. Here, an oxygen‐induced lattice strain (OILS) strategy is developed to achieve OSCs with both high mobility and high stability. Utilizing the strategy, the maximum mobility of dinaphtho[2,3‐b:2′,3′‐f]thieno[3,2‐b]thiophene (DNTT) organic field‐effect transistor (OFET) rises to 15.3 cm2 V−1 s−1 and the contact resistance lowers to 25.5 Ω cm. Remarkably, the thermal stability of DNTT is much improved, and a record saturated power density of ≈3.4 × 104 W cm−2 is obtained. Both the experiments and theoretical calculations demonstrate that the lattice compressive strain induced by oxygen is responsible for their high performance and stability. Furthermore, the universality of the strategy is manifested in both n‐type and p‐type small OSCs. This work provides a novel strategy to improve both the mobility and the stability of OSCs, paving the way for the practical applications of organic devices.
Funder
National Supercomputing Center of Tianjin
Natural Science Foundation of Tianjin Municipality
National Natural Science Foundation of China
Key Technologies Research and Development Program
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by
4 articles.
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