Ultralow Thermal Conductivity, Multiband Electronic Structure and High Thermoelectric Figure of Merit in TlCuSe-Reference-Cited by-同舟云学术

Ultralow Thermal Conductivity, Multiband Electronic Structure and High Thermoelectric Figure of Merit in TlCuSe

Published:2021-09-14 Issue:44 Volume:33 Page:2104908
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Lin Wenwen¹²,He Jiangang²,Su Xianli¹³,Zhang Xiaomi²,Xia Yi²,Bailey Trevor P.⁴,Stoumpos Constantinos C.¹⁵,Tan Ganjian¹³,Rettie Alexander J. E.⁶⁷,Chung Duck Young⁶,Dravid Vinayak P.²,Uher Ctirad⁴,Wolverton Chris²,Kanatzidis Mercouri G.¹²⁵^ORCID

Affiliation:

1. Department of Chemistry Northwestern University Evanston IL 60208 USA

2. Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA

3. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan 430070 China

4. Department of Physics University of Michigan Ann Arbor MI 48109 USA

5. Department of Materials Science and Technology University of Crete Heraklion GR‐70013 Greece

6. Materials Science Division Argonne National Laboratory Lemont IL 60439 USA

7. Electrochemical Innovation Lab Department of Chemical Engineering University College London Bloomsbury London WC1E 6BT UK

Funder

U.S. Department of Energy

Office of Science

Basic Energy Sciences