Electrical Doping of Metal Halide Perovskites by Co‐Evaporation and Application in PN Junctions

Author:

Schramm Tim12,Deconinck Marielle12,Ji Ran12,Siliavka Elena12,Hofstetter Yvonne J.12,Löffler Markus3,Shilovskikh Vladimir V.12,Brunner Julius12,Li Yanxiu12,Bitton Sapir4,Tessler Nir4,Vaynzof Yana12ORCID

Affiliation:

1. Chair for Emerging Electronic Technologies Technical University of Dresden Nöthnitzer Str. 61 01187 Dresden Germany

2. Leibniz‐Institute for Solid State and Materials Research Dresden Helmholtzstraße 20 01069 Dresden Germany

3. Dresden Center for Nanoanalysis (DCN) Technische Universität Dresden Helmholtzstraße 18 01069 Dresden Germany

4. Sara and Moshe Zisapel Nanoelectronic Center Electrical and Computer Engineering Technion Israel Institute of Technology Haifa 32000003 Israel

Abstract

AbstractElectrical doping of semiconductors is a revolutionary development that enabled many electronic and optoelectronic technologies. While doping of many inorganic and organic semiconductors is well‐established, controlled electrical doping of metal halide perovskites (MHPs) is yet to be demonstrated. In this work, efficient n‐ and p‐type electrical doping of MHPs by co‐evaporating the perovskite precursors alongside organic dopant molecules is achieved. It is demonstrated that the Fermi level can be shifted by up to 500 meV toward the conduction band and by up to 400 meV toward the valence band by n‐ and p‐doping, respectively, which increases the conductivity of the films. The doped layers are employed in PN and NP diodes, showing opposing trends in rectification. Demonstrating controlled electrical doping by a scalable, industrially relevant deposition method opens the route to developing perovskite devices beyond solar cells, such as thermoelectrics or complementary logic.

Funder

Deutsche Forschungsgemeinschaft

European Research Council

Publisher

Wiley

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Electronic Doping in Perovskite Solar Cells;Advanced Electronic Materials;2024-05-26

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