Sequential Dual Alignments Introduce Synergistic Effect on Hexagonal Boron Nitride Platelets for Superior Thermal Performance

Author:

Chen Yunxia1,Gao Zhiming2,Hoo Simon A.1,Tipnis Varun1,Wang Renjing1,Mitevski Ivan1,Hitchcock Dale3,Simmons Kevin L.4,Sun Ya‐Ping5,Sarntinoranont Malisa1,Huang Yong16ORCID

Affiliation:

1. Department of Mechanical and Aerospace Engineering University of Florida Gainesville FL 32611 USA

2. Oak Ridge National Laboratory 1 Bethel Valley Road Oak Ridge TN 37830 USA

3. Savannah River National Laboratory Savannah River Site Aiken SC 29808 USA

4. Pacific Northwest National Laboratory 902 Battelle Boulevard Richland WA 99354 USA

5. Department of Chemistry Clemson University Clemson SC 29634 USA

6. Department of Materials Science and Engineering University of Florida Gainesville FL 32611 USA

Abstract

AbstractPlanarly aligning 2D platelets is challenging due to their additional orientational freedom compared to 1D materials. This study reports a sequential dual‐alignment approach, employing an extrusion‐printing‐induced shear force and rotating‐magnetic‐field‐induced force couple for platelet planarly alignment in a yield‐stress support bath. It is hypothesized that the partial alignment induced by a directional shear force facilitates subsequent axial rotation of the platelets for planar alignment under an external force couple, resulting in a synergistic alignment effect. This sequential dual‐alignment approach achieves better planar alignment of 2D modified hexagonal boron nitride (mhBN). Specifically, the thermal conductivity of the 40 wt% mhBN/epoxy composite is significantly higher (692%) than that of unaligned composites, surpassing the cumulative effect of individual methods (only 133%) with a 5 times more synergistic effect. For 30, 40, and 50 wt% mhBN composites, the thermal conductivity values (5.9, 9.5, and 13.8 W m−1 K−1) show considerable improvement compared to the previously reported highest values (5.3, 6.6, and 8.6 W m−1 K−1). Additionally, a 3D mhBN/epoxy heat sink is printed and evaluated to demonstrate the feasibility of device fabrication. The approach enables the planar alignment of electrically or thermally conducting 2D fillers during 3D fabrication.

Funder

National Science Foundation

U.S. Department of Energy

Publisher

Wiley

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