Launching and Manipulation of Higher‐Order In‐Plane Hyperbolic Phonon Polaritons in Low‐Dimensional Heterostructures

Author:

Lu Guanyu1ORCID,Pan Zhiliang1,Gubbin Christopher R.2,Kowalski Ryan A.3,De Liberato Simone2,Li Deyu1,Caldwell Joshua D.1ORCID

Affiliation:

1. Department of Mechanical Engineering Vanderbilt University Nashville TN 37212 USA

2. School of Physics and Astronomy University of Southampton Southampton SO17 1BJ UK

3. Interdisciplinary Materials Science Vanderbilt University Nashville TN 37212 USA

Abstract

AbstractHyperbolic phonon polaritons (HPhPs) are stimulated by coupling infrared (IR) photons with the polar lattice vibrations. Such HPhPs offer low‐loss, highly confined light propagation at subwavelength scales with out‐of‐plane or in‐plane hyperbolic wavefronts. For HPhPs, while a hyperbolic dispersion implies multiple propagating modes with a distribution of wavevectors at a given frequency, so far it has been challenging to experimentally launch and probe the higher‐order modes that offer stronger wavelength compression, especially for in‐plane HPhPs. In this work, the experimental observation of higher‐order in‐plane HPhP modes stimulated on a 3C‐SiC nanowire (NW)/α‐MoO3 heterostructure is reported where leveraging both the low‐dimensionality and low‐loss nature of the polar NWs, higher‐order HPhPs modes within 2D α‐MoO3 crystal are launched by the 1D 3C‐SiC NW. The launching mechanism is further studied and the requirements for efficiently launching of such higher‐order modes are determined. In addition, by altering the geometric orientation between the 3C‐SiC NW and α‐MoO3 crystal, the manipulation of higher‐order HPhP dispersions as a method of tuning is demonstrated. This work illustrates an extremely anisotropic low dimensional heterostructure platform to confine and configure electromagnetic waves at the deep‐subwavelength scales for a range of IR applications including sensing, nano‐imaging, and on‐chip photonics.

Funder

National Science Foundation

Office of Naval Research

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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