Affiliation:
1. School of Science and Engineering The Chinese University of Hong Kong Shenzhen Guangdong 518172 China
2. Department of Aeronautical and Aviation Engineering The Hong Kong Polytechnic University Hung Hom Kowloon Hong Kong 999077 China
3. The Research Institute for Sports Science and Technology The Hong Kong Polytechnic University Hung Hom Kowloon Hong Kong 999077 China
4. Laboratory of Environmental Science and Technology The Xinjiang Technical Institute of Physics and Chemistry Key Laboratory of Functional Materials and Devices for Special Environments Chinese Academy of Sciences Urumqi 830011 China
Abstract
AbstractSoft electronics are garnering significant attention due to their wide‐ranging applications in artificial skin, health monitoring, human–machine interaction, artificial intelligence, and the Internet of Things. Various soft physical sensors such as mechanical sensors, temperature sensors, and humidity sensors are the fundamental building blocks for soft electronics. While the fast growth and widespread utilization of electronic devices have elevated life quality, the consequential electromagnetic interference (EMI) and radiation pose potential threats to device precision and human health. Another substantial concern pertains to overheating issues that occur during prolonged operation. Therefore, the design of multifunctional soft electronics exhibiting excellent capabilities in sensing, EMI shielding, and thermal management is of paramount importance. Because of the prominent advantages in chemical stability, electrical and thermal conductivity, and easy functionalization, new carbon materials including carbon nanotubes, graphene and its derivatives, graphdiyne, and sustainable natural‐biomass‐derived carbon are particularly promising candidates for multifunctional soft electronics. This review summarizes the latest advancements in multifunctional soft electronics based on new carbon materials across a range of performance aspects, mainly focusing on the structure or composite design, and fabrication method on the physical signals monitoring, EMI shielding, and thermal management. Furthermore, the device integration strategies and corresponding intriguing applications are highlighted. Finally, this review presents prospects aimed at overcoming current barriers and advancing the development of state‐of‐the‐art multifunctional soft electronics.
Funder
National Natural Science Foundation of China
China Postdoctoral Science Foundation
Apple University Development Fund, Apple University Consortium
Shenzhen Science and Technology Innovation Program
Natural Science Foundation of Shenzhen Municipality
Cited by
4 articles.
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