Rationalized Electroepitaxy toward Scalable Single‐Crystal Zn Anodes

Abstract

AbstractElectroepitaxy is recognized as an effective approach to prepare metal electrodes with nearly complete reversibility. Nevertheless, large‐scale manipulation is still not attainable owing to complicated interfacial chemistry. Here, the feasibility of extending Zn electroepitaxy toward the bulk phase over a mass‐produced mono‐oriented Cu(111) foil is demonstrated. Interfacial Cu–Zn alloy and turbulent electroosmosis are circumvented by adopting a potentiostatic electrodeposition protocol. The as‐prepared Zn single‐crystalline anode enables stable cycling of symmetric cells at a stringent current density of 50.0 mA cm−2. The assembled full cell further sustaines a capacity retention of 95.7% at 5.0 A g−1 for 1500 cycles, accompanied by a controllably low N/P ratio of 7.5. In addition to Zn, Ni electroepitaxy can be realized by using the same approach. This study may inspire rational exploration of the design of high‐end metal electrodes.