Recent Progress in Colloidal Quantum Dot Thermoelectrics

Author:

Nugraha Mohamad Insan12,Indriyati Indriyati23,Primadona Indah24,Gedda Murali1,Timuda Gerald Ensang2,Iskandar Ferry34,Anthopoulos Thomas D.1ORCID

Affiliation:

1. Physical Science and Engineering Division (PSE) KAUST Solar Center (KSC), King Abdullah University of Science and Technology (KAUST) Thuwal 23955‐6900 Saudi Arabia

2. Research Center for Advanced Materials National Research and Innovation Agency (BRIN) South Tangerang Banten 15314 Indonesia

3. Department of Physics Faculty of Mathematics and Natural Sciences Institut Teknologi Bandung Jl. Ganesha 10 Bandung 40132 Indonesia

4. Collaboration Research Center for Advanced Energy Materials National Research and Innovation Agency – Institut Teknologi Bandung Jl. Ganesha 10 Bandung 40135 Indonesia

Abstract

AbstractSemiconducting colloidal quantum dots (CQDs) represent an emerging class of thermoelectric materials for use in a wide range of future applications. CQDs combine solution processability at low temperatures with the potential for upscalable manufacturing via printing techniques. Moreover, due to their low dimensionality, CQDs exhibit quantum confinement and a high density of grain boundaries, which can be independently exploited to tune the Seebeck coefficient and thermal conductivity, respectively. This unique combination of attractive attributes makes CQDs very promising for application in emerging thermoelectric generator (TEG) technologies operating near room temperature. Herein, recent progress in CQDs for application in emerging thin‐film thermoelectrics is reviewed. First, the fundamental concepts of thermoelectricity in nanostructured materials are outlined, followed by an overview of the popular synthetic methods used to produce CQDs with controllable sizes and shapes. Recent strides in CQD‐based thermoelectrics are then discussed with emphasis on their application in thin‐film TEGs. Finally, the current challenges and future perspectives for further enhancing the performance of CQD‐based thermoelectric materials for future applications are discussed.

Funder

King Abdullah University of Science and Technology

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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