Active Ultrahigh‐ <i>Q</i> (0.2 × 10 <sup>6</sup> ) THz Topological Cavities on a Chip-Reference-Cited by-同舟云学术

Active Ultrahigh‐ Q (0.2 × 10 ⁶ ) THz Topological Cavities on a Chip

Published:2022-05-29 Issue:27 Volume:34 Page:2202370
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Advanced Materials

Author:

Kumar Abhishek¹²^ORCID,Gupta Manoj¹²,Pitchappa Prakash³,Tan Thomas Caiwei¹²,Chattopadhyay Udvas¹,Ducournau Guillaume⁴,Wang Nan³,Chong Yidong¹²,Singh Ranjan¹²^ORCID

Affiliation:

1. Division of Physics and Applied Physics School of Physical and Mathematical Sciences Nanyang Technological University Singapore 637371 Singapore

2. Centre for Disruptive Photonic Technologies The Photonics Institute Nanyang Technological University Singapore 639798 Singapore

3. Agency for Science, Technology and Research Institute of Microelectronics 2 Fusionopolis Way Singapore 138634 Singapore

4. Institut d'Electronique de Microelectronique et de Nanotechnologie (IEMN) UMR CNRS 8520 Universite de Lille 1 Villeneuve d'Ascq CEDEX 59652 France

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202202370

Reference59 articles.

1. Terahertz band: Next frontier for wireless communications

2. Wireline/wireless RF-Interconnect for future SoC

3. Progress in Low-Power Switched Optical Interconnects

4. THz interconnect: the last centimeter communication

5. Innovations in Terahertz Interconnects: High-Speed Data Transport Over Fully Electrical Terahertz Waveguide Links

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