Affiliation:
1. Department of Biomicrosystem Technology Korea University Seoul 02841 Republic of Korea
2. Department of Chemical and Biological Engineering Korea University Seoul 02841 Republic of Korea
3. KU‐KIST Graduate School of Converging Science and Technology Korea University Seoul 02841 Republic of Korea
4. Department of Integrated Energy Engineering (College of Engineering) and KU Photonics Center Korea University Seoul 02841 Republic of Korea
5. Center for Opto‐Electronic Materials and Devices Post‐Silicon Semiconductor Institute Korea Institute of Science and Technology (KIST) Seoul 02792 Republic of Korea
Abstract
AbstractOptical Fourier surfaces (OFSs), characterized by sinusoidally profiled diffractive optical elements, can outperform traditional binary‐type counterparts by minimizing optical noise through selectively driving diffraction at desired frequencies. While scanning probe lithography (SPL), gray‐scale electron beam lithography (EBL), and holographic inscriptions are effective for fabricating OFSs, achieving full‐color diffractions at fundamental efficiency limits is challenging. Here, an integrated manufacturing process is presented, validated theoretically and experimentally, for fully transparent OFSs reaching the fundamental limit of diffraction efficiency. Leveraging holographic inscriptions and soft nanoimprinting, this approach effectively addresses challenges in conventional OFS manufacturing, enabling scalable production of noise‐free and maximally efficient OFSs with record‐high throughput (1010–1012 µm2 h−1), surpassing SPL and EBL by 1010 times. Toward this end, a wafer‐scale OFSs array is demonstrated consisting of full‐color diffractive gratings, color graphics, and microlenses by the one‐step nanoimprinting, which is readily compatible with rapid prototyping of OFSs even on curved panels, demanding for transformative optical devices such as augmented and virtual reality displays.