Electroconductive, Adhesive, Non‐Swelling, and Viscoelastic Hydrogels for Bioelectronics (Adv. Mater. 4/2023)-Reference-Cited by-同舟云学术

Electroconductive, Adhesive, Non‐Swelling, and Viscoelastic Hydrogels for Bioelectronics (Adv. Mater. 4/2023)

Published:2023-01 Issue:4 Volume:35 Page:
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Advanced Materials

Author:

Han Im Kyung¹,Song Kang‐Il²,Jung Sang‐Mun¹,Jo Yeonggwon³,Kwon Jaesub¹,Chung Taehun¹,Yoo Surim³,Jang Jinah³⁴⁵⁶,Kim Yong‐Tae¹,Hwang Dong Soo³⁶⁷,Kim Youn Soo¹³⁸

Affiliation:

1. Department of Materials Science and Engineering Pohang University of Science and Technology (POSTECH) Pohang 37673 Republic of Korea

2. Medical Device Development Center Daegu‐Gyeongbuk Medical Innovation Foundation Daegu 41061 Republic of Korea

3. School of Interdisciplinary Bioscience and Bioengineering Pohang University of Science and Technology (POSTECH) Pohang 37673 Republic of Korea

4. Department of Mechanical Engineering Pohang University of Science and Technology (POSTECH) Pohang 37673 Republic of Korea

5. Department of Convergence IT Engineering Pohang University of Science and Technology (POSTECH) Pohang 37673 Republic of Korea

6. Institute for Convergence Research and Education in Advanced Technology Yonsei University Seoul 03722 Republic of Korea

7. Division of Environmental Science and Engineering Pohang University of Science and Technology (POSTECH) Pohang 37673 Republic of Korea

8. Department of Chemical Engineering Pohang University of Science and Technology (POSTECH) Pohang 37673 Republic of Korea

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202370028

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