Affiliation:
1. School of Materials Science and Engineering Tongji University Shanghai 201804 P. R. China
2. Translational Research Institute of Brain and Brain‐Like Intelligence Shanghai Key Laboratory of Anesthesiology and Brain Functional Modulation Shanghai Fourth People's Hospital Affiliated to Tongji University Tongji University Shanghai 200434 P. R. China
3. National Key Laboratory of Autonomous Intelligent Unmanned Systems Tongji University Shanghai 201804 P. R. China
Abstract
AbstractOrganic optoelectronic synaptic devices that can reliably operate in high‐temperature environments (i.e., beyond 121°C) or remain stable after high‐temperature treatments have significant potential in biomedical electronics and bionic robotic engineering. However, it is challenging to acquire this type of organic devices considering the thermal instability of conventional organic materials and the degradation of photoresponse mechanisms at high temperatures. Here, high‐temperature synaptic phototransistors (HTSPs) based on thermally stable semiconductor polymer blends as the photosensitive layer are developed, successfully simulating fundamental optical‐modulated synaptic characteristics at a wide operating temperature range from room temperature to 220°C. Robust optoelectronic performance can be observed in HTSPs even after experiencing 750 h of the double 85 testing due to the enhanced operational reliability. Using HTSPs, Morse‐code optical decoding scheme and the visual object recognition capability are also verified at elevated temperatures. Furthermore, flexible HTSPs are fabricated, demonstrating an ultralow power consumption of 12.3 aJ per synaptic event at a low operating voltage of −0.05 mV. Overall, the conundrum of achieving reliable optical‐modulated neuromorphic applications while balancing low power consumption can be effectively addressed. This research opens up a simple but effective avenue for the development of high‐temperature and energy‐efficient wearable optoelectronic devices in neuromorphic computing applications.
Funder
National Key Research and Development Program of China
National Natural Science Foundation of China
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by
8 articles.
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