1. Thin film interconnect processes
2. , in Diffusion Phenomena in Thin Films and Microelectronic Materials, ( (Eds.), Noyes Publications, Park Ridge, N. J. 1988, 369.
3. Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
4. (Ed.), Handbook of the Physicochemical Properties of the Elements, IFI-Plenum, New York 1968.
5. , , Lehrbuch der Anorganischen Chemie, 101. Auflage, Walter De Gryter Verlag Berlin 1995, 1341.