Author:
Jakob A.,Schmidt H.,Walfort B.,Rheinwald G.,Fr�hauf S.,Schulz S.,Gessner T.,Lang H.
Reference34 articles.
1. Thin film interconnect processes
2. in Diffusion Phenomena in Thin Films and Microelectronic Materials, (eds.), Noyes Publications, Park Ridge, NJ, 1988, 369.
3. Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
4. ?Lehrbuch der Anorganischen Chemie?, 101. Auflage, Walter De Gryter A. Verlag, Berlin, 1995, 1341.
5. ?The Chemistry of Metal CVD?, VCH, Weinheim 1994, 305 ff, und darin zitierte Literatur.
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献