Process Optimization of Ion Plating Nickel-Copper-Silver Thin Film Deposition
Publisher
John Wiley & Sons, Inc.
Reference19 articles.
1. Simulation of doping profile formation: Historical evolution and present strengths and weaknesses;Zechner;J. Vac. Sci. Technology B.,2008
2. Modeling of plasma-target interaction during reactive magnetron sputtering of TiN;Moller;Journal of Applied Physics,2007
3. Simulation to Predict Target Erosion of Planar DC Magnetron;Qiu;Plasma Science and Technology,2008