Architectural Technical Debt in Embedded Systems
Author:
Affiliation:
1. Chalmers University of Technology; Computer Science and Engineering; Gothenburg Sweden
Publisher
Wiley
Subject
Automotive Engineering
Reference16 articles.
1. Comparison of Scenario-Based Software Architecture Evaluation Methods
2. A decade of agile methodologies: Towards explaining agile software development;Dingsøyr;J. Syst. Softw.,2012
3. Applying Agile Development in Mass-Produced Embedded Systems
4. Industrial Challenges of Scaling Agile in Mass-Produced Embedded Systems
5. A portfolio approach to technical debt management
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