30‐5: Late‐News Paper: Development of a highly reliable Mini‐LED display module using simultaneous transfer and bonding (SITRAB) technology

Abstract

In this study, we present the development of a highly reliable 64 × 64 Mini‐LED display, where the LED array is transferred/bonded onto a glass substrate using SITRAB technology and materials. The display substrate was fabricated by patterning two layers of Cu on top of heat‐resistant glass with a thickness of 500 μm. We applied SITRAB solder paste containing type 6 solder powder based on a resin matrix to the display substrate using screen printing. Subsequently, we transferred and bonded the 64 × 64 color LED array using the SITRAB process. The pixel pitch is 450 μm, corresponding to a 78" 4K display. No bad pixels were found among a total of 12288 LEDs. We analyzed the shear strength and reliability test results of LED chips bonded using SITRAB materials and processes. By applying SITRAB materials, the shear strength of the LED chips was increased by 27% before and 45% after reliability testing compared to the chips without added resin.