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Ultrawide band CBCPW to stripline vertical transition in multilayer LCP substrates

  • Published:2015-03-27 Issue:6 Volume:57 Page:1481-1484
  • ISSN:0895-2477
  • Container-title:Microwave and Optical Technology Letters
  • language:en
  • Short-container-title:Microw. Opt. Technol. Lett.

Author:

Zhang Yifei1,Shi Shouyuan1,Martin Richard D.1,Prather Dennis W.1

Affiliation:

1. Department of Electrical and Computer Engineering; University of Delaware; Evans 140, Newark, Delaware 19716

Funder

University of Delaware

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Benefits of mixed dielectrics when used for high-frequency PCB applications;Coonrod;High Frequency Electron,2012

2. Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz;Thompson;IEEE Trans Microwave Theory Tech,2004

3. Ultrabroad-band vertical transition for multilayer integrated circuits;Zhu;IEEE Microwave Guided Wave Lett,1999

4. Broadband vertical interconnects using slot-coupled shielded microstrip lines;VandenBerg;IEEE Trans Microwave Theory Tech,1992

5. A broadband and vialess vertical microstrip-to-microstrip transition;Huang;IEEE Trans Microwave Theory Tech,2012

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Horizontal Gradual Ultra-Low-Reflection Stripline to Grounded Coplanar Waveguide Transition;2022 IEEE MTT-S International Wireless Symposium (IWS);2022-08-12

2. Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies;Molecules;2022-02-16

3. Broadband vertical transition based on LCP multilayer substrate;2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2021-11-15

4. Ultra-Wideband Vialess Microstrip Line-to-Stripline Transition in Multilayer LCP Substrate for $E$ - and $W$ -Band Applications;IEEE Microwave and Wireless Components Letters;2017-12

5. Ultra-Wideband Microstrip Line-to-Microstrip Line Transition in Multilayer LCP Substrate at Millimeter-Wave Frequencies;IEEE Microwave and Wireless Components Letters;2017-10
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