On‐chip triplexer using series‐first structure for connecting radio frequency modules in a 65 nm <scp>CMOS</scp>-Reference-Cited by-同舟云学术

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On‐chip triplexer using series‐first structure for connecting radio frequency modules in a 65 nm CMOS

Published:2022-02-15 Issue:4 Volume:64 Page:721-726
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Micro & Optical Tech Letters

Author:

Lim Jeong‐Taek¹,Oh Hyun‐Myung²,Lee Sangrok¹³,Jung Bang Chul¹,Kim Choul‐Young¹^ORCID

Affiliation:

1. Department of Electronics Engineering Chungnam National University Daejeon South Korea

2. Convergence Navigation R&D Center, DusiTech Daejeon South Korea

3. Space Environment Test Division, Satellite Research Directorate. Korea Aerospace Research Institute Daejeon South Korea

Funder

National Research Foundation of Korea

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/mop.33191

Reference27 articles.

1. High Isolation and Compact Diplexer Using the Hybrid Resonators

2. Miniaturized Diplexer Using Synthesized Microstrip Lines With Series LC Tanks

3. A Diplexer Based on Transmission Lines, Implemented in LTCC

4. Design of Microstrip Lowpass-Bandpass Triplexer With High Isolation

5. WanzongL YongH XiaopengZ JieW XiaoW WeiyongL.A compact tri‐band antenna switch module for compass satellite positioning application. Paper presented at: Asia‐Pacific Microwave Conference 2013; November 2013; Seoul South Korea.

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