Humidity acceleration factor for plastic packaged electronic devices-Reference-Cited by-同舟云学术

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Humidity acceleration factor for plastic packaged electronic devices

Published:1991-09 Issue:5 Volume:7 Page:365-370
ISSN:0748-8017
Container-title:Quality and Reliability Engineering International
language:en
Short-container-title:Qual. Reliab. Engng. Int.

Author:

Klinger David J.

Publisher

Wiley

Subject

Management Science and Operations Research,Safety, Risk, Reliability and Quality

Reference56 articles.

1. Private communication, August 1989.

2. ‘Corrosion of electronic device metallization’, Proceedings of the Interuniversity Microelectronics Center Summer Course on Reliability, Leuven, Belgium, 7 June 1989.

3. and , Analysis of Survival Data, Chapman and Hall, London, 1984.

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