Early detection of ageing in solder joints through laser probe thermal analysis of the peltier effect-Reference-Cited by-同舟云学术

Early detection of ageing in solder joints through laser probe thermal analysis of the peltier effect

Published:1994 Issue:4 Volume:10 Page:289-295
ISSN:0748-8017
Container-title:Quality and Reliability Engineering International
language:en
Short-container-title:Qual. Reliab. Engng. Int.

Author:

Claeys W.,Quintard V.,Dilhaire S.,Lewis D.,Danto Y.

Publisher

Wiley

Subject

Management Science and Operations Research,Safety, Risk, Reliability and Quality

Reference6 articles.

1. Testing of the quality of solder joints through the analysis of their thermal behaviour with an interferometric laser probe

2. and , ‘Reliability approach in automatove electronics’, ESREF 92, Schwäbish-Gmünd, Germany, (October 1992), p. 133.

3. , and , Thermomechanical failure analysis of SMD solder joints. Proc. ESREF 92, Schwäbisch-Gmünd. Germany. 1992, p. 327.

4. ‘Etude du comportement thermomécanéique et de la fiabilité d'assemblages de composants montés en surface, utilisés en environnement automobile sévère’, Thèse de Doctoral. Université de Bordeaux I, 1993.

5. and , ‘Laser infrared signature feed back enhances solder joint reliability’. SEPCON WEST. 1989.

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3. Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing : a new method for measuring the bond quality;Microelectronics Reliability;1998-06

4. LASER PROBE MEASUREMENTS OF QUALITY EVOLUTION OF SOLDER JOINTS DURING THERMAL CYCLING AGEING TESTS;Quality and Reliability Engineering International;1996-11

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