1. and , ‘Failure prediction methodology calculations can mislead: use them wisely, not blindly’, NAECON 89 paper, March 1989.
2. Failure rate of a cold- or hot-spared component with a lognormal lifetime
3. and , ‘Electromigration, thermal analysis and die attach—a case history’, 20th Ann. Proc Rel. Phys. Symp., IEEE, 1982, pp. 34–44.
4. and , ‘The distribution of electromigration failures’, 24th Ann. Rel. Phys. Symp., IEEE, 1986, pp. 1–6.