Direct Microrolling Processing on a Silicon Wafer-Reference-Cited by-同舟云学术

Direct Microrolling Processing on a Silicon Wafer

Published:2017-08-14 Issue:36 Volume:13 Page:1701630
ISSN:1613-6810
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language:en
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Author:

Aoki Kanna¹^ORCID,Ishiguro Keita¹,Denokami Masaki¹,Tanahashi Yuya¹,Furusawa Kentaro²,Sekine Norihiko²,Adschiri Tadafumi³,Fujii Minoru¹

Affiliation:

1. Department of Electrical and Electronic EngineeringGraduate School of EngineeringKobe University 1‐1 Rokkodai, Nada Kobe Hyogo 657‐8501 Japan

2. Frontier Research LaboratoryNational Institute of Information and Communications Technology 4‐2‐1 Nukui‐Kitamachi Koganei Tokyo 184‐8795 Japan

3. World Premier International Research Center‐Advanced Institute for Materials Research (WPI‐AIMR)Tohoku University 2‐1‐1 Katahira Aoba‐ku Sendai 980‐8577 Japan

Funder

Advanced Machining Technology and Development Association

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.201701630

Reference25 articles.

1. Preparation of curved two-dimensional electron systems in InGaAs/GaAs-microtubes

2. Optical microcavities on Si formed by self-assembled InGaAs/GaAs quantum dot microtubes

3. Optically pumped rolled-up InGaAs/GaAs quantum dot microtube lasers

4. Geometry Effect on the Strain-Induced Self-Rolling of Semiconductor Membranes

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