Tuning of ultraviolet‐curable ink printability via in situ ultraviolet irradiation during direct ink write applications

Author:

Jackson Sean1ORCID,Zaragoza Lysette2,Kumar Balaji Krisna1,Dickens Tarik1ORCID

Affiliation:

1. Department of Industrial & Manufacturing Engineering, High‐Performance Materials Institute FAMU‐FSU College of Engineering Tallahassee Florida USA

2. Department of Mechanical Engineering San Jose State University San Jose California USA

Abstract

AbstractDirect ink write deposition facilitates line‐by‐line extrusion of inks spanning wide viscoelastic ranges. Following deposition, post processing technologies permit tuning of the extrudate's material property characteristics—ultraviolet (UV) irradiation, facilitating the photopolymerization of UV‐reactive catalyst solutions, permits targeted modification of the extrudate's microstructure and in situ tuning of extrudate macrostructure. This report analyzes the morphological, rheological, and microstructural property relationships governing the printability, and processivity, of extruded UV‐curable resin inks for delineation of sufficiency and optimization of ink printability utilizing direct ink write technologies. A design‐of‐experiments approach is implemented to quantify significance regarding an extrudate's dimensional response to extrusion parameter variation and in situ processing parameters, identifying proportionally of nozzle velocity, nozzle height, and UV irradiation exposure with extrudate aspect ratio, reflected by respective maximum extrudate aspect ratio increases of 158% and 109%, regarding 121 and 123K resin inks. Finally, the relationship between extrudate morphology and microstructure variation was assessed via dielectric cure monitoring, whereby an extrudate's ion viscosity was calculated in relation to its rheological modulus, reflecting the relationship between an extrudate's morphology, rheological response, and printability, regarding its microstructural variation.

Funder

National Science Foundation

Publisher

Wiley

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