Magnetic Processing of Lead Free Solder Systems-Reference-Cited by-同舟云学术

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Magnetic Processing of Lead Free Solder Systems

Published:2015-10-30 Issue: Volume: Page:51-56
ISSN:2637-4390
Container-title:Processing and Properties of Advanced Ceramics and Composites VII
language:
Short-container-title:

Author:

Ripley Edward,Hallman Russell,Stowe Ashley C.

Publisher

John Wiley & Sons, Inc.

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119183860.ch6/fullpdf

Reference19 articles.

1. J. Geibig M. Socolof 2005

2. 19 23 2003

3. N. Lee I. Artaki J. Slattery J. Sovinsky P. Vianco

4. www.indium.com/techlibrary/whitepapers/a-dropin-leadfree-solder-replacement 2009

5. M. Frederickson 2009

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The effect of permanent magnet stirring on the corrosion resistance of Sn-2.0Ag-0.5Cu-2Zn solder alloys in NaCl solution;Materials Chemistry and Physics;2023-07

2. Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field;Microelectronics Reliability;2020-10

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