Wearable Sensing Systems with Mechanically Soft Assemblies of Nanoscale Materials-Reference-Cited by-同舟云学术

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Wearable Sensing Systems with Mechanically Soft Assemblies of Nanoscale Materials

Published:2017-06-19 Issue:9 Volume:2 Page:1700053
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Lee Youngsik¹²,Kim Jaemin¹²,Joo Hyunwoo¹²,Raj Milan S.³,Ghaffari Roozbeh³⁴,Kim Dae-Hyeong¹²

Affiliation:

1. Center for Nanoparticle Research; Institute for Basic Science (IBS); Seoul 08826 Republic of Korea

2. School of Chemical and Biological Engineering; Institute of Chemical Processes; Seoul National University; Seoul 08826 Republic of Korea

3. MC10 Inc.; 10 Maguire Rd. Lexington MA 02421 USA

4. Center for Bio-integrated Electronics; Technological Institute; Northwestern University; 2145 Sheridan Road Evanston IL 60208-3109 USA

Funder

International Biometric Society

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Reference107 articles.

1. Epidermal Electronics

2. A skin-inspired organic digital mechanoreceptor

3. Paper Skin Multisensory Platform for Simultaneous Environmental Monitoring

4. Soft Thermal Sensor with Mechanical Adaptability

5. Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications

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