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Deformable Electronics: Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)

  • Published:2016-06 Issue:22 Volume:28 Page:4564-4564
  • ISSN:0935-9648
  • Container-title:Advanced Materials
  • language:en
  • Short-container-title:Adv. Mater.

Author:

Oh Jin Young12,Kim Sunghee3,Baik Hong-Koo3,Jeong Unyong4

Affiliation:

1. Department of Chemical Engineering; Stanford University; CA 94305 USA

2. Research Institute of Iron and Steel Technology; Yonsei University; 134 Shinchon-dong Seoul 120-749 South Korea

3. Department of Materials Science and Engineering; Yonsei University; 134 Shinchon Dong Seoul 120-749 South Korea

4. Department of Materials Science and Engineering; Pohang University of Science and Technology; Cheongam-Ro 77 Nam-Gu Pohang 790-784 South Korea

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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