Flexible Electronic Substrate Film Fabricated Using Natural Clay and Wood Components with Cross-Linking Polymer-Reference-Cited by-同舟云学术

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Flexible Electronic Substrate Film Fabricated Using Natural Clay and Wood Components with Cross-Linking Polymer

Published:2017-03-01 Issue:17 Volume:29 Page:1606512
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Takahashi Kiyonori¹,Ishii Ryo¹,Nakamura Takashi¹,Suzuki Asami¹,Ebina Takeo¹,Yoshida Manabu²,Kubota Munehiro³,Nge Thi Thi⁴,Yamada Tatsuhiko⁴

Affiliation:

1. National Institute of Advanced Industrial Science and Technology (AIST); 4-2-1 Nigatake, Miyagino-ku Sendai Miyagi 983-8551 Japan

2. National Institute of Advanced Industrial Science and Technology (AIST); 1-1-1 Higashi Tsukuba Ibaraki 305-8565 Japan

3. Kunimine Industries Co., Ltd; 23-5 Kuidesaku, Shimofunao-machi Joban, Iwaki Fukushima 972-8312 Japan

4. Forestry and Forest Products Research Institute (FFPRI); 1 Matsunosato Tsukuba Ibaraki 305-8687 Japan

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/adma.201606512/fullpdf

Reference55 articles.

1. Nanoparticle chemisorption printing technique for conductive silver patterning with submicron resolution

2. An ultra-lightweight design for imperceptible plastic electronics

3. Tunable Carbon Nanotube Thin-Film Transistors Produced Exclusively via Inkjet Printing

4. Water-Based Isotropically Conductive Adhesives: Towards Green and Low-Cost Flexible Electronics

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