3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications-Reference-Cited by-同舟云学术

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3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications

Published:2019-09-12 Issue:15 Volume:32 Page:1902994
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Karnaushenko Daniil¹,Kang Tong¹,Bandari Vineeth K.¹²³,Zhu Feng¹²³,Schmidt Oliver G.¹²³⁴^ORCID

Affiliation:

1. Institute for Integrative Nanosciences Leibniz IFW Dresden Dresden 01069 Germany

2. Material Systems for Nanoelectronics Chemnitz University of Technology Chemnitz 09107 Germany

3. Research Center for Materials Architectures and Integration of Nanomembranes (MAIN) Rosenbergstraße 6 TU Chemnitz Chemnitz 09126 Germany

4. School of Science TU Dresden Dresden 01062 Germany

Funder

Deutsche Forschungsgemeinschaft

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.201902994

Reference332 articles.

1. The chips are down for Moore’s law

2. Manufacturing Systems Complexity Review: Challenges and Outlook

3. Invention of the integrated circuit

4. Robert Noyce and Fairchild Semiconductor, 1957–1968

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