Thin Film Thermoelectric Metal–Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity-Reference-Cited by-同舟云学术

Thin Film Thermoelectric Metal–Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity

Published:2015-04-28 Issue:22 Volume:27 Page:3453-3459
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Erickson Kristopher J.¹,Léonard François¹,Stavila Vitalie¹,Foster Michael E.¹,Spataru Catalin D.¹,Jones Reese E.¹,Foley Brian M.²,Hopkins Patrick E.²,Allendorf Mark D.¹,Talin A. Alec¹

Affiliation:

1. Sandia National Laboratories Livermore CA 94551 USA

2. Department of Mechanical and Aerospace Engineering University of Virginia Charlottesville VA 22904 USA

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.201501078

Reference28 articles.

1. Hydrogen Storage in Metal–Organic Frameworks

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3. Towards Conducting Metal-Organic Frameworks

4. Mn2(2,5-disulfhydrylbenzene-1,4-dicarboxylate): A Microporous Metal–Organic Framework with Infinite (−Mn–S−)∞ Chains and High Intrinsic Charge Mobility

5. High Electrical Conductivity in Ni3(2,3,6,7,10,11-hexaiminotriphenylene)2, a Semiconducting Metal–Organic Graphene Analogue

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