82-1: Invited Paper: Large Area Thin Film Encapsulation from Bendable to Rollable and Foldable
Author:
Affiliation:
1. AKT Applied Materials Inc.; 3101 Scott Blvd. Santa Clara California 95054
Publisher
Wiley
Reference5 articles.
1. Material challenge for flexible organic devices;Lewis;Materials Today,2006
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4. Mechanics of curvature and strain in flexible organic electronic devices
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