The influence of the bumping height on the performance of flip-chipped CPW Lange couplers-Reference-Cited by-同舟云学术

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The influence of the bumping height on the performance of flip-chipped CPW Lange couplers

Published:2001 Issue:4 Volume:29 Page:263-267
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Microw. Opt. Technol. Lett.

Author:

Carchon G.,Nauwelaers B.

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips, IEEE MTT-S Dig, Orlando, FL, 1995, pp. 1591-1594.

2. and Investigation of MMIC flip chips with sealants for improved reliability without hermeticity, IEEE MTT-S Dig, 1996, pp. 239-242.

3. and Millimeter-wave performance of chip interconnections using wire bonding and flip chip, IEEE MTT-S Dig, 1996, pp. 247-250.

4. and Advantages of flip chip technology in millimeter-wave packaging, IEEE MTT-S Dig, Denver, CO, 1997, pp. 987-990.

5. Millimeter-wave characteristics of flip-chip interconnects for multichip modules

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