A new test structure for recombination measurements in thin si layers for VLSI structures
Author:
Publisher
Wiley
Subject
Electrical and Electronic Engineering
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/ett.4460010317/fullpdf
Reference13 articles.
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3. Alpha particle tracks in Silicon and their effect on Dinamic MOS RAM reliability;Yaney;IEEE Trans. Electron Devices,1979
4. R. S. Payne, W. N. Grant, W. J. Bertarn: Elimination of latch-up in bulk CMOS. Technical Digest, Intl. Electron Devices Mtg, 1980, p. 248-251.
5. Modeling and measurement of minority-carrier lifetime versus doping in diffused layers of n+ -p silicon diodes;Roulston;IEEE Trans. Electron Devices,1982
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electrical measurement of electron and hole mobilities as a function of injection level in silicon;IEEE Transactions on Electron Devices;1996
2. Analytical model of the effective recombination velocity of diffused p−p+ (n−n+) high-low junctions at arbitrary injection level;Solid-State Electronics;1994-01
3. Detection of recombination centers in epitaxial layers by temperature scanning and depth lifetime profiling;IEEE Electron Device Letters;1991-06
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