Overcoming the voltage losses caused by the acceptor‐based interlayer in laminated indoor OPVs

Author:

Beket Gulzada12ORCID,Zubayer Anton3,Zhang Qilun4,Stahn Jochen5,Eriksson Fredrik3,Fahlman Mats4,Österberg Thomas2,Bergqvist Jonas2,Gao Feng1ORCID

Affiliation:

1. Department of Physics, Chemistry and Biology (IFM), Division of Electronic and Photonic Materials (EFM) Linköping University Linköping Sweden

2. Epishine AB Linköping Sweden

3. Department of Physics, Chemistry and Biology (IFM), Division of Thin Film Physics Linköping University Linköping Sweden

4. Laboratory of Organic Electronics, Department of Science and Technology (ITN) Linköping University Linköping Sweden

5. Paul Scherer Institut (PSI) Villigen Switzerland

Abstract

AbstractHarvesting indoor light to power electronic devices for the Internet of Things has become an application scenario for emerging photovoltaics, especially utilizing organic photovoltaics (OPVs). Combined liquid‐ and solid‐state processing, such as printing and lamination used in industry for developing indoor OPVs, also provides a new opportunity to investigate the device structure, which is otherwise hardly possible based on the conventional approach due to solvent orthogonality. This study investigates the impact of fullerene‐based acceptor interlayer on the performance of conjugated polymer–fullerene‐based laminated OPVs for indoor applications. We observe open‐circuit voltage (VOC) loss across the interface despite this arrangement being presumed to be ideal for optimal device performance. Incorporating insulating organic components such as polyethyleneimine (PEI) or polystyrene (PS) into fullerene interlayers decreases the work function of the cathode, leading to better energy level alignment with the active layer (AL) and reducing the VOC loss across the interface. Neutron reflectivity studies further uncover two different mechanisms behind the VOC increase upon the incorporation of these insulating organic components. The self‐organized PEI layer could hinder the transfer of holes from the AL to the acceptor interlayer, while the gradient distribution of the PS‐incorporated fullerene interlayer eliminates the thermalization losses. This work highlights the importance of structural dynamics near the extraction interfaces in OPVs and provides experimental demonstrations of interface investigation between solution‐processed cathodic fullerene layer and bulk heterojunction AL.

Publisher

Wiley

Subject

General Medicine

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