An Analytical Solution for Fully Developed Forced Convection in Triangular Ducts
Author:
Affiliation:
1. Mechanical Engineering Department; Shahrood University; Shahrood Iran
Publisher
Wiley
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/htj.21132/fullpdf
Reference31 articles.
1. Laminar flow friction and forced convection heat transfer in ducts of arbitrary geometry;Shah;Int J Heat Mass Transfer,1975
2. An exact analytical solution for convective heat transfer in rectangular ducts;Shahmardan;J Zhejiang Univ Sci A,2012
3. Combined forced and free flow in a vertical rectangular duct with prescribed wall heat flux;Barletta;Int J Heat Fluid Flow,2003
4. Forced convection heat transfer in rectangular ducts-general case of wall resistances and peripheral conduction for ventilation cooling of nuclear waste repositories;Lyczkowski;Nucl Eng Des,1982
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Full Solutions to Flow and Heat Transfer from Slip-Induced Microtube Shapes;Micromachines;2023-04-21
2. Effect of Rounded Corners on Heat Transfer and Fluid Flow Through Triangular Duct;Journal of Heat Transfer;2018-08-28
3. Analytic modeling of laminar forced convection in a circular duct for arbitrary boundary conditions and inlet temperature profile;International Journal of Heat and Mass Transfer;2017-09
4. Effect of apex angle variation on thermal and hydraulic performance of roughened triangular duct;International Communications in Heat and Mass Transfer;2017-08
5. Flow and heat transfer of a Giesekus fluid in plane and 3D ducts;Heat Transfer-Asian Research;2017-05-17
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3