Microneedle Patches‐Integrated Transdermal Bioelectronics for Minimally Invasive Disease Theranostics

Author:

Wang Zifeng1ORCID,Xiao Min1,Li Zhanhong1,Wang Xinghao1,Li Fangjie2,Yang Huayuan2,Chen Yu3,Zhu Zhigang14ORCID

Affiliation:

1. School of Health Science and Engineering University of Shanghai for Science and Technology 516 Jungong Road Shanghai 200093 China

2. School of Acupuncture‐Moxibustion and Tuina Shanghai University of Traditional Chinese Medicine 1200 Cailun Road Shanghai 201203 China

3. Materdicine Lab, School of Life Sciences Shanghai University 99 Shangda Road Shanghai 200444 China

4. Health Industry Innovation Center Xin‐Huangpu Joint Innovation Institute of Chinese Medicine 81 Xiangxue Middle Avenue, Huangpu District Guangzhou Guangdong Province 510799 China

Abstract

AbstractWearable epidermal electronics with non‐ or minimally‐invasive characteristics can collect, transduce, communicate, and interact with accessible physicochemical health indicators on the skin. However, due to the stratum corneum layer, rich information about body health is buried under the skin stratum corneum layer, for example, in the skin interstitial fluid. Microneedle patches are typically designed with arrays of special microsized needles of length within 1000 µm. Such characteristics potentially enable the access and sample of biomolecules under the skin or give therapeutical treatment painlessly and transdermally. Integrating microneedle patches with various electronics allows highly efficient transdermal bioelectronics, showing their great promise for biomedical and healthcare applications. This comprehensive review summarizes and highlights the recent progress on integrated transdermal bioelectronics based on microneedle patches. The design criteria and state‐of‐the‐art fabrication techniques for such devices are initially discussed. Next, devices with different functions, including but not limited to health monitoring, drug delivery, and therapeutical treatment, are highlighted in detail. Finally, key issues associated with current technologies and future opportunities are elaborated to sort out the state of recent research, point out potential bottlenecks, and provide future research directions.

Funder

University of Shanghai for Science and Technology

Publisher

Wiley

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