Promoting CO2 Electroreduction to Multi‐Carbon Products by Hydrophobicity‐Induced Electro‐Kinetic Retardation

Author:

Zhuansun Mengjiao1,Liu Yue2,Lu Ruihu3ORCID,Zeng Fan1,Xu Zhanyou4ORCID,Wang Ying4ORCID,Yang Yaoyue2ORCID,Wang Ziyun3ORCID,Zheng Gengfeng5ORCID,Wang Yuhang1ORCID

Affiliation:

1. Institute of Functional Nano & Soft Materials (FUNSOM) Jiangsu Key Laboratory for Advanced Negative Carbon Technologies Soochow University Suzhou 215123 China

2. School of Chemistry and Environment Southwest Minzu University Chengdu 610041 China

3. School of Chemical Sciences University of Auckland Auckland 1010 New Zealand

4. Department of Chemistry Chinese University of Hong Kong N.T. Hong Kong SAR 999077 China

5. Laboratory of Advanced Materials Shanghai Key Laboratory of Molecular Catalysis and Innovative Materials Fudan University Shanghai 200438 China

Abstract

AbstractAdvancing the performance of the Cu‐catalyzed electrochemical CO2 reduction reaction (CO2RR) is crucial for its practical applications. Still, the wettable pristine Cu surface often suffers from low exposure to CO2, reducing the Faradaic efficiencies (FEs) and current densities for multi‐carbon (C2+) products. Recent studies have proposed that increasing surface availability for CO2 by cation‐exchange ionomers can enhance the C2+ product formation rates. However, due to the rapid formation and consumption of *CO, such promotion in reaction kinetics can shorten the residence of *CO whose adsorption determines C2+ selectivity, and thus the resulting C2+ FEs remain low. Herein, we discover that the electro‐kinetic retardation caused by the strong hydrophobicity of quaternary ammonium group‐functionalized polynorbornene ionomers can greatly prolong the *CO residence on Cu. This unconventional electro‐kinetic effect is demonstrated by the increased Tafel slopes and the decreased sensitivity of *CO coverage change to potentials. As a result, the strongly hydrophobic Cu electrodes exhibit C2+ Faradaic efficiencies of ≈90 % at a partial current density of 223 mA cm−2, more than twice of bare or hydrophilic Cu surfaces.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Publisher

Wiley

Subject

General Chemistry,Catalysis

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