Reactive Superhydrophobic Surfaces for Interlayer Electrical Connectivity in Three‐dimensional Electronics

Abstract

AbstractThis study describes the development of a new type of amine‐reactive superhydrophobic (RSH) film that is facilely coated on various substrates using a single‐step process, while the versatility of this RSH film offers a reliable solution for efficient formation of complex and robust interlayer electrical connectivity (IEC) in 3D electronic systems. The excellent spatial controllability of surface amine modification enables the generation of vertical circuits in situ, providing a distinct way to connect circuits located on different layers. Moreover, the inherent superhydrophobicity and porosity exhibit the required anti‐fouling and breathability properties, making the RSH‐based IEC well‐suited for applications where exposure to environmental gas and liquid contaminants is likely. This approach provides another avenue towards the development of IEC in 3D flexible integrated electronics, opening up new possibilities for the advancement of this field.