Redox Concomitant Formation Method for Fabrication of Cu(I)−MOF/Polymer Composites with Antifouling Properties

Author:

He Wenxiu1,Li Xiangyu2,Dai Xueya3,Shao Lei1,Fu Yu1,Xu Dake2,Qi Wei3ORCID

Affiliation:

1. Department of Chemistry College of Sciences Northeastern University Shenyang 110819 P. R. China

2. Shenyang National Laboratory for Materials Science Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education) School of Materials Science and Engineering Northeastern University Shenyang 110819 P. R. China

3. Institute of Metal Research Shenyang National Laboratory for Materials Science Chinese Academy of Sciences Shenyang 110016 P. R. China

Abstract

AbstractMarine biofouling, which is one of the technical challenges hindering the growth of the marine economy, has been controlled using cuprous oxide (Cu2O) nanoparticles due to the exceptional antifouling properties of Cu(I) ions. However, Cu2O nanoparticles have encountered bottlenecks due to explosive releases of Cu+ ions, high toxicity at elevated doses, and long‐term instability. Here, we present a novel method called Redox Concomitant Formation (RCF) for fabricating a hierarchical Cu(I) metal–organic framework polypyrrole (Cu(I)−MOF/PPy) composite. This method enables in situ phase transition via successive redox reactions that change the chemical valence state and coordination mode of Cu(II)−MOF, resulting in a new structure of Cu(I)−MOF while creating a PPy layer surrounded by the hierarchical structure. Owing to the steady release of Cu+ ions from the Cu(I) sites and photothermal properties of PPy, Cu(I)−MOF/PPy exhibits superior and broad‐spectrum resistance to marine bacteria, algae, and surface‐adhered biofilms in complex biological environments, as well as long‐term stability, resulting in 100 % eradication efficiency under solar‐driven heating. Mechanistic insights into successive structural redox reactions and formation using the RCF method are provided in detail, enabling the fabrication of novel MOFs with the desired composition and structure for a wide range of potential applications.

Publisher

Wiley

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