New rigid vinyl compound molding technology-Reference-Cited by-同舟云学术

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New rigid vinyl compound molding technology

Published:1996-06 Issue:2 Volume:2 Page:129-133
ISSN:1083-5601
Container-title:Journal of Vinyl and Additive Technology
language:en
Short-container-title:J Vinyl Addit Technol

Author:

Summers James W.,Toyoda Paul,Weir Scott,Beal Chris,Toensing Carl

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Polymers and Plastics,General Chemical Engineering,General Chemistry

Reference5 articles.

1. The additive heat history of PVC stability

2. Study of the variables affecting pressure drop and temperature rise in blow molding dies

3. Temperature profiles for polymer melts in tube flow. Part II. Conduction and shear heating corrections

4. Plastics World, September 1994, pp. 20-31.

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