An engineering study of the film embossing process-Reference-Cited by-同舟云学术

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An engineering study of the film embossing process

Published:1985-08 Issue:11 Volume:25 Page:698-713
ISSN:0032-3888
Container-title:Polymer Engineering and Science
language:en
Short-container-title:Polym. Eng. Sci.

Author:

Kamal M. R.,Haber A.,Ryan M. E.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Reference25 articles.

1. and paper presented at 33rd C.S.Ch.E. Conference, Toronto, Ontario, October 5, 1983.

2. and ?Conduction of Heat in Solids, Second Edition,? Oxford University Press, New York (1959).

3. and ?Applied Numerical Methods,? John Wiley & Sons, New York (1969).

4. ?Transient Heating of a Film in a Combined Mode,? Technical Report, Union Carbide Corporation (1971).

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Dynamic modeling of the mold filling process in an injection molding machine;Polymer Engineering and Science;1991-10

2. Adaptive model following control of the mold filling process in an injection molding machine;Polymer Engineering and Science;1991-08

3. The effect of processing conditions on the microstructure of embossed polyethylene films;Polymer Engineering and Science;1988-02

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